- Scholarships
- Miscellaneous
- NETwork BICP - Lewis Latimer Scholarship
NETwork BICP - Lewis Latimer Scholarship
The AT&T/NETwork BICP - Lewis Latimer Scholarship supports graduating high school seniors and undergraduate students attending a member institution, HBCU, or four-year college or university. Students pursuing a degree in a STEAM field are encouraged to apply. Recipients are selected based on demonstrated financial need.
07.30.26
deadline passed
$2,500
Award amount
1
Requirements
Limited listing data; review the visible fields before planning next steps.
ScholarshipTop workspace
Listing checks
Key signals from this listing.
Application path
Application path included
Application destination is available.
Review status
Jul 13, 2026
Review date is available.
Deadline urgency
Expired
The catalog deadline appears to have passed. Save it if you want to track a future cycle.
Application difficulty
Easy
Difficulty comes from ScholarshipTop structured application signals. Use it to plan your preparation workload.
Core fields are present for this listing.
Who can apply
- Minimum 2.75 GPA Resident of the U.S. High school senior or undergraduate student Seeking a bachelor's degree at a member institution, HBCU, or 4year college or university Studying in STEAM field U.S. citizen, permanent resident, or U.S. national Demonstrate financial need
Match workspace
Find scholarships that fit your profile
Quick facts
Status
Open
Study levels
High school senior, College freshman, College sophomore, College junior, College senior
Field of study
Agriculture and Related Sciences, Biological and Biomedical Sciences, Business Management and Marketing, Communication and Journalism, Computer and Information Sciences, Education, Engineering, English Language and Literature, Foreign Languages Literature and Linguistics, Health Professions and Clinical Sciences, Mathematics and Statistics, Multi Interdisciplinary Studies, Natural Resources and Conservation, Psychology, Security and Protective Services, Social Sciences, Transportation and Materials Moving, Visual and Performing Arts
Eligible institutions
Payout method
Paid to the college or financial aid office
Application details
Key requirements (1)
Program rules and conditions to use while preparing your application materials.
Required documents
Listed materials from this opportunity.
- Financial documentation (if required)
Award & payment
Amount: $2,500
Payout: Paid to the college or financial aid office
About the provider
Overview
Who may apply: Minimum 2.75 GPA Resident of the U.S. High school senior or undergraduate student Seeking a bachelor's degree at a member institution, HBCU, or 4year college or university Studying in STEAM field
Sponsor & application
Information last verified Jul 13, 2026.
Use the provider path for final terms before submitting. Verification methodology